Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit

Shang Chih Lin; Frank Yong

doi:doi:10.11648/j.ajece.20210502.14

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Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit

Shang Chih Lin, Frank Yong

Published in American Journal of Electrical and Computer Engineering (Volume 5, Issue 2)

Received: 2 May 2021 Accepted: 20 May 2021 Published: 4 September 2021

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Abstract

Advanced technology nodes with small feature sizes and increased design complexity make it increasingly time-consuming to determine the root cause of yield loss. Several of the defects also occur inside a circuit making physical failure analysis (PFA) and electrical failure analysis (EFA) much more challenging. EFA has been instrumental in driving product yield and reliability for consumer products such as mobile phones and computer chips. It involves the use of state-of-the-art tools and techniques. One of the main changes EFA analyses is an enhancement of dynamic EFA in circuit failed in functional test. We propose a technique for advanced Electrical Failure Analysis (EFA) tool with a Superconducting Nanowire Single Photon Detector (SnSPD) system and its application to low voltage Time-Resolved Emission (TRE) measurements (also known as Picosecond Imaging Circuit Analysis, PICA) of scaled VLSI circuits with enhanced sensitivity for discussing Time Resolved Emission (TRE). In order to understand the figures of advantage that a single-photon detector should have to enable the acquisition of time resolved emission waveforms for low voltage applications. We will provide that measurements down to a low 1 V supply voltage were made possible by a careful optimization of the detector front-end electronics. We also characterized the emission from devices with different threshold voltages in order to understand how the emission contributions depend on this parameter and how this affects the resulting waveform. we hope to be able to show soon even better results that should allow continued application of the non-invasive TRE and PICA technology towards future scaled nodes with smaller gates and lower supply voltages.

Published in	American Journal of Electrical and Computer Engineering (Volume 5, Issue 2)
DOI	10.11648/j.ajece.20210502.14
Page(s)	72-76
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2024. Published by Science Publishing Group

Keywords

PICA, TRE, Functional, EFA

References

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[20]	F. Stellari et al., “On-chip power supply noise measurement using Time Resolved Emission (TRE) waveforms of Light Emission from Off-State Leakage Current (LEOSLC)”, ITC, 2009, paper 8.1, pp. 1-10.
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APA Style

Shang Chih Lin, Frank Yong. (2021). Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit. American Journal of Electrical and Computer Engineering, 5(2), 72-76. https://doi.org/10.11648/j.ajece.20210502.14

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ACS Style

Shang Chih Lin; Frank Yong. Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit. Am. J. Electr. Comput. Eng. 2021, 5(2), 72-76. doi: 10.11648/j.ajece.20210502.14

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AMA Style

Shang Chih Lin, Frank Yong. Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit. Am J Electr Comput Eng. 2021;5(2):72-76. doi: 10.11648/j.ajece.20210502.14

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@article{10.11648/j.ajece.20210502.14,
  author = {Shang Chih Lin and Frank Yong},
  title = {Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit},
  journal = {American Journal of Electrical and Computer Engineering},
  volume = {5},
  number = {2},
  pages = {72-76},
  doi = {10.11648/j.ajece.20210502.14},
  url = {https://doi.org/10.11648/j.ajece.20210502.14},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ajece.20210502.14},
  abstract = {Advanced technology nodes with small feature sizes and increased design complexity make it increasingly time-consuming to determine the root cause of yield loss. Several of the defects also occur inside a circuit making physical failure analysis (PFA) and electrical failure analysis (EFA) much more challenging. EFA has been instrumental in driving product yield and reliability for consumer products such as mobile phones and computer chips. It involves the use of state-of-the-art tools and techniques. One of the main changes EFA analyses is an enhancement of dynamic EFA in circuit failed in functional test. We propose a technique for advanced Electrical Failure Analysis (EFA) tool with a Superconducting Nanowire Single Photon Detector (SnSPD) system and its application to low voltage Time-Resolved Emission (TRE) measurements (also known as Picosecond Imaging Circuit Analysis, PICA) of scaled VLSI circuits with enhanced sensitivity for discussing Time Resolved Emission (TRE). In order to understand the figures of advantage that a single-photon detector should have to enable the acquisition of time resolved emission waveforms for low voltage applications. We will provide that measurements down to a low 1 V supply voltage were made possible by a careful optimization of the detector front-end electronics. We also characterized the emission from devices with different threshold voltages in order to understand how the emission contributions depend on this parameter and how this affects the resulting waveform. we hope to be able to show soon even better results that should allow continued application of the non-invasive TRE and PICA technology towards future scaled nodes with smaller gates and lower supply voltages.},
 year = {2021}
}

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TY  - JOUR
T1  - Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit
AU  - Shang Chih Lin
AU  - Frank Yong
Y1  - 2021/09/04
PY  - 2021
N1  - https://doi.org/10.11648/j.ajece.20210502.14
DO  - 10.11648/j.ajece.20210502.14
T2  - American Journal of Electrical and Computer Engineering
JF  - American Journal of Electrical and Computer Engineering
JO  - American Journal of Electrical and Computer Engineering
SP  - 72
EP  - 76
PB  - Science Publishing Group
SN  - 2640-0502
UR  - https://doi.org/10.11648/j.ajece.20210502.14
AB  - Advanced technology nodes with small feature sizes and increased design complexity make it increasingly time-consuming to determine the root cause of yield loss. Several of the defects also occur inside a circuit making physical failure analysis (PFA) and electrical failure analysis (EFA) much more challenging. EFA has been instrumental in driving product yield and reliability for consumer products such as mobile phones and computer chips. It involves the use of state-of-the-art tools and techniques. One of the main changes EFA analyses is an enhancement of dynamic EFA in circuit failed in functional test. We propose a technique for advanced Electrical Failure Analysis (EFA) tool with a Superconducting Nanowire Single Photon Detector (SnSPD) system and its application to low voltage Time-Resolved Emission (TRE) measurements (also known as Picosecond Imaging Circuit Analysis, PICA) of scaled VLSI circuits with enhanced sensitivity for discussing Time Resolved Emission (TRE). In order to understand the figures of advantage that a single-photon detector should have to enable the acquisition of time resolved emission waveforms for low voltage applications. We will provide that measurements down to a low 1 V supply voltage were made possible by a careful optimization of the detector front-end electronics. We also characterized the emission from devices with different threshold voltages in order to understand how the emission contributions depend on this parameter and how this affects the resulting waveform. we hope to be able to show soon even better results that should allow continued application of the non-invasive TRE and PICA technology towards future scaled nodes with smaller gates and lower supply voltages.
VL  - 5
IS  - 2
ER  -

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Author Information

Shang Chih Lin

Gallant Precision Machining Co., Ltd, Hsin Chu, Taiwan
Frank Yong

Gallant Precision Machining Co., Ltd, Hsin Chu, Taiwan

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APA Style

Shang Chih Lin, Frank Yong. (2021). Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit. American Journal of Electrical and Computer Engineering, 5(2), 72-76. https://doi.org/10.11648/j.ajece.20210502.14

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ACS Style

Shang Chih Lin; Frank Yong. Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit. Am. J. Electr. Comput. Eng. 2021, 5(2), 72-76. doi: 10.11648/j.ajece.20210502.14

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AMA Style

Shang Chih Lin, Frank Yong. Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit. Am J Electr Comput Eng. 2021;5(2):72-76. doi: 10.11648/j.ajece.20210502.14

Copy | Download

@article{10.11648/j.ajece.20210502.14,
  author = {Shang Chih Lin and Frank Yong},
  title = {Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit},
  journal = {American Journal of Electrical and Computer Engineering},
  volume = {5},
  number = {2},
  pages = {72-76},
  doi = {10.11648/j.ajece.20210502.14},
  url = {https://doi.org/10.11648/j.ajece.20210502.14},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ajece.20210502.14},
  abstract = {Advanced technology nodes with small feature sizes and increased design complexity make it increasingly time-consuming to determine the root cause of yield loss. Several of the defects also occur inside a circuit making physical failure analysis (PFA) and electrical failure analysis (EFA) much more challenging. EFA has been instrumental in driving product yield and reliability for consumer products such as mobile phones and computer chips. It involves the use of state-of-the-art tools and techniques. One of the main changes EFA analyses is an enhancement of dynamic EFA in circuit failed in functional test. We propose a technique for advanced Electrical Failure Analysis (EFA) tool with a Superconducting Nanowire Single Photon Detector (SnSPD) system and its application to low voltage Time-Resolved Emission (TRE) measurements (also known as Picosecond Imaging Circuit Analysis, PICA) of scaled VLSI circuits with enhanced sensitivity for discussing Time Resolved Emission (TRE). In order to understand the figures of advantage that a single-photon detector should have to enable the acquisition of time resolved emission waveforms for low voltage applications. We will provide that measurements down to a low 1 V supply voltage were made possible by a careful optimization of the detector front-end electronics. We also characterized the emission from devices with different threshold voltages in order to understand how the emission contributions depend on this parameter and how this affects the resulting waveform. we hope to be able to show soon even better results that should allow continued application of the non-invasive TRE and PICA technology towards future scaled nodes with smaller gates and lower supply voltages.},
 year = {2021}
}

Copy | Download

TY  - JOUR
T1  - Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuit
AU  - Shang Chih Lin
AU  - Frank Yong
Y1  - 2021/09/04
PY  - 2021
N1  - https://doi.org/10.11648/j.ajece.20210502.14
DO  - 10.11648/j.ajece.20210502.14
T2  - American Journal of Electrical and Computer Engineering
JF  - American Journal of Electrical and Computer Engineering
JO  - American Journal of Electrical and Computer Engineering
SP  - 72
EP  - 76
PB  - Science Publishing Group
SN  - 2640-0502
UR  - https://doi.org/10.11648/j.ajece.20210502.14
AB  - Advanced technology nodes with small feature sizes and increased design complexity make it increasingly time-consuming to determine the root cause of yield loss. Several of the defects also occur inside a circuit making physical failure analysis (PFA) and electrical failure analysis (EFA) much more challenging. EFA has been instrumental in driving product yield and reliability for consumer products such as mobile phones and computer chips. It involves the use of state-of-the-art tools and techniques. One of the main changes EFA analyses is an enhancement of dynamic EFA in circuit failed in functional test. We propose a technique for advanced Electrical Failure Analysis (EFA) tool with a Superconducting Nanowire Single Photon Detector (SnSPD) system and its application to low voltage Time-Resolved Emission (TRE) measurements (also known as Picosecond Imaging Circuit Analysis, PICA) of scaled VLSI circuits with enhanced sensitivity for discussing Time Resolved Emission (TRE). In order to understand the figures of advantage that a single-photon detector should have to enable the acquisition of time resolved emission waveforms for low voltage applications. We will provide that measurements down to a low 1 V supply voltage were made possible by a careful optimization of the detector front-end electronics. We also characterized the emission from devices with different threshold voltages in order to understand how the emission contributions depend on this parameter and how this affects the resulting waveform. we hope to be able to show soon even better results that should allow continued application of the non-invasive TRE and PICA technology towards future scaled nodes with smaller gates and lower supply voltages.
VL  - 5
IS  - 2
ER  -

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